Damage-Free Heat Pipe Technology: A Revolution in Electronic Cooling Based on Preset Shape Manufacturing-Breaking the Post-Forming Paradox and Industrialization Path

With the rapid development of consumer electronics lightweighting, surging demand for high-power chip cooling, and the expansion of emerging scenarios (such as satellite thermal control and electric vehicle IGBT), traditional sintered wick heat pipes face the core contradiction of "post-forming performance degradation". Mechanical bending/ flattening causes damage to the capillary structure, resulting in over 40% reduction in thermal performance, which severely restricts the heat dissipation efficiency of highly integrated devices. This paper proposes Damage-Free Heat Pipe (DFHP) technology, which realizes the manufacturing paradigm shift from "post-forming adaptation" to "native matching" through geometric-material-process-performance four-dimensional reconstruction. Experimental data show that DFHP achieves a 42% reduction in thermal resistance, 54% improvement in capillary force, and 35% higher yield compared to traditional post-formed heat pipes under the same shape constraints. Multi-physics simulation and extreme environment tests further verify its structural stability and performance advantages, providing a key solution for high- density electronic cooling.